3M™ 8708-025 (117mm x 96mm) Thermally Conductive Interface Tape
Thermally Conductive Pressure Sensitive Adhesive Tape
3M™ Thermally Conductive Interface Tape 8708 Series is a pressure-sensitive adhesive tape filled with thermally conductive ceramic particles. The 8708-025 grade provides good thermal conductivity, low thermal impedance and reliable adhesion for thermal management and component bonding applications.
Key Features
- Good thermal conductivity of approximately 0.6 W/m-K for efficient heat transfer.
- Electrically insulating construction helps provide thermal management without electrical conduction.
- Low thermal impedance supports effective heat transfer between components and heat sinks.
- Reliable adhesion performance on aluminum and stainless-steel surfaces.
- Thin 0.25mm construction helps maintain a low-profile thermal interface.
- Vibration damping capability helps provide reliable bonding in electronic assemblies.
Product Highlights
Thermal Conductivity
Provides approximately 0.6 W/m-K thermal conductivity to support efficient heat transfer between electronic components and thermal management surfaces.
Electrically Insulating
Electrically insulating construction helps provide thermal transfer while maintaining electrical isolation between bonded components.
Low Thermal Impedance
Low thermal impedance helps minimize thermal resistance at the interface and supports effective heat dissipation.
Reliable Adhesion
Designed to provide good and reliable adhesion performance on aluminum and stainless-steel surfaces.
Thin Profile
The 0.25mm thickness provides a compact thermal interface solution for applications where limited space is available.
Vibration Damping
The adhesive construction provides vibration damping characteristics that can help improve bonding reliability in assemblies.
Product Construction
3M™ Thermally Conductive Interface Tape 8708 Series uses a pressure-sensitive adhesive construction filled with thermally conductive ceramic particles. This construction allows the tape to provide thermal conductivity while maintaining electrical insulation.
The 8708-025 grade has a thickness of approximately 0.25mm and is supplied in a 117mm x 96mm format. Its thin construction and pressure-sensitive adhesive properties make it suitable for bonding and thermal interface applications in electronic assemblies.
Specifications
| Product Name | 3M™ Thermally Conductive Interface Tape 8708-025 |
|---|---|
| Product Series | 8708 Series |
| Manufacturer | 3M |
| Manufacturer Part Number | 8708-025 |
| Product Type | Thermally Conductive Interface Tape |
| Roll / Sheet Size | 117mm x 96mm |
| Thickness | 0.25mm |
| Thermal Conductivity | 0.6 W/m-K |
| Electrical Property | Electrically Insulating |
| Thermal Property | Low Thermal Impedance |
| Adhesive Type | Pressure Sensitive Adhesive |
| Filler | Thermally Conductive Ceramic Particles |
| Surface Adhesion | Aluminum (Al) and Stainless Steel (SUS) |
| Vibration Damping | Yes |
| Part Status | Active |
| RoHS Status | RoHS Compliant |
Resources
Technical Data Sheet
View or download the technical data sheet for 3M™ 8708-025 (117mm x 96mm) Thermally Conductive Interface Tape.
View TDSApplications
Heat Sink Bonding
Suitable for general heat sink bonding applications where reliable thermal transfer and adhesion are required.
IC Chip Packaging
Useful for heat conduction applications in IC chip packaging and electronic component assemblies.
Printed Circuit Boards
Designed for thermal interface and component bonding applications in printed circuit board assemblies.
LED Module Bonding
Suitable for LED module and board bonding applications requiring effective thermal management.
Flat-Panel Displays
Useful for thermal interface and assembly applications in LCD, PDP and other flat-panel devices.
COF Chip Heat Conduction
Suitable for chip-on-film applications where thermal conduction and compact bonding are required.
Product Uses
3M™ Thermally Conductive Interface Tape 8708-025 is designed for thermal management and bonding applications where heat needs to be transferred between electronic components and heat-dissipating surfaces.
The tape can be used for general heat sink bonding, IC chip packaging heat conduction, printed circuit boards, LED modules and boards, flat-panel display assemblies and COF chip heat conduction. Its electrically insulating construction, low thermal impedance and thin 0.25mm profile make it suitable for compact electronic assemblies.
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