3M™ 8708-025 Thermally Conductive Interface Tape
20mm × 40m Roll | 0.25 mm Thickness
3M™ Thermally Conductive Interface Tape 8708-025 is a pressure sensitive adhesive tape filled with thermally conductive ceramic particles. The 20mm × 40m roll provides a practical thermal interface solution for heat sink bonding, electronic components, LED assemblies, PCB applications and other thermal management requirements.
Key Features
- Good thermal conductivity of approximately 0.6 W/m-K for efficient thermal transfer.
- Electrically insulating construction helps provide thermal transfer while maintaining electrical isolation.
- Low thermal impedance supports efficient heat transfer across the thermal interface.
- Good and reliable adhesion performance for aluminum and stainless steel surfaces.
- Thermally conductive ceramic-filled construction provides effective thermal interface performance.
- 0.25 mm thin profile is suitable for compact electronic and thermal management assemblies.
- Vibration damping capability provides additional mechanical performance in assembly applications.
- Convenient 20mm × 40m roll format is suitable for component-level thermal bonding applications.
Product Highlights
0.6 W/m-K Thermal Conductivity
Provides good thermal conductivity for transferring heat between electronic components and heat dissipation surfaces.
Electrical Insulation
The thermally conductive interface tape provides thermal transfer while maintaining electrical insulation between mating surfaces.
Low Thermal Impedance
Designed to support efficient thermal transfer and improve the interface between heat-generating components and heat sinks.
Reliable Adhesion
Provides good and reliable adhesion performance on aluminum and stainless steel surfaces commonly used in thermal management assemblies.
0.25 mm Thin Construction
The thin 0.25 mm construction helps provide a compact thermal interface for electronics and space-constrained assemblies.
Vibration Damping
The pressure sensitive tape construction can help provide vibration damping while maintaining thermal interface performance.
Product Construction
3M™ Thermally Conductive Interface Tape 8708-025 is a pressure sensitive adhesive tape filled with thermally conductive ceramic particles. The ceramic filler provides thermal conductivity while the adhesive construction provides bonding performance for thermal management assemblies.
With a thickness of approximately 0.25 mm, the tape provides a thin thermal interface between components and heat dissipation surfaces. Its electrically insulating construction allows thermal transfer without creating an electrically conductive path.
The tape provides good and reliable adhesion to materials including aluminum and stainless steel. Its pressure sensitive construction also provides vibration damping for suitable assembly applications.
The 20mm × 40m roll format is suitable for applications requiring narrow-width thermal interface tape and can be used for heat sink bonding, electronic component thermal management, LED assemblies and PCB applications.
Specifications
| Product Name | 3M™ Thermally Conductive Interface Tape 8708-025 |
|---|---|
| Product Series | 3M™ Thermally Conductive Interface Tape 8708 Series |
| Manufacturer | 3M |
| Manufacturer Part Number | 8708-025 |
| Product Type | Thermally Conductive Interface Tape |
| Adhesive Type | Pressure Sensitive Adhesive |
| Filler | Thermally Conductive Ceramic Particles |
| Total Tape Thickness | 0.25 mm |
| Thermal Conductivity | 0.6 W/m-K |
| Electrical Property | Electrically Insulating |
| Thermal Property | Low Thermal Impedance |
| Adhesion Surface | Aluminum (Al) and Stainless Steel (SUS) |
| Vibration Damping | Yes |
| Roll Width | 20 mm |
| Roll Length | 40 m |
| Roll Size | 20 mm × 40 m |
| Part Status | Active |
| Series | 8708 |
| RoHS Status | RoHS Compliant |
Technical values are typical/representative and should be verified against the latest manufacturer technical documentation before being used as specification limits for a particular application.
Resources
Technical Data Sheet
View or download the technical information for 3M™ Thermally Conductive Interface Tape 8708 Series and product 8708-025.
View TDSApplications
General Heat Sink Bonding
Suitable for bonding heat sinks and providing a thermal interface between heat-generating components and heat dissipation surfaces.
IC Chip Packaging
Designed for thermal conduction applications around IC chip packaging where efficient heat transfer and electrical insulation are required.
Printed Circuit Boards
Suitable for thermal interface applications on PCB assemblies and electronic components requiring thermal management.
LED Module & Board Bonding
Suitable for LED modules and boards where heat needs to be transferred from the LED assembly to a thermal management structure.
Flat Panel Display Assembly
Suitable for thermal management applications in flat-panel display assemblies including LCD and PDP devices.
COF Chip Heat Conduction
Suitable for chip-on-film applications requiring thermal conduction and electrical insulation within compact electronic assemblies.
Product Uses
3M™ Thermally Conductive Interface Tape 8708-025 is designed to create a thermal interface between heat-generating components and heat dissipation structures. The thermally conductive ceramic-filled adhesive helps transfer heat across the interface.
The 20mm × 40m roll is particularly suitable for narrow-width thermal bonding requirements in electronic assemblies. It can be used for heat sink bonding, IC chip packaging, PCB thermal management and LED module or board bonding.
The tape can also be used in flat-panel display assemblies such as LCD and PDP devices, as well as COF chip heat conduction applications where thermal transfer and electrical insulation are required.
The combination of approximately 0.6 W/m-K thermal conductivity, low thermal impedance, electrical insulation, reliable adhesion and vibration damping makes 8708-025 a versatile thermal interface tape for electronics and thermal management applications.
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