3M™ Polyimide Film Tape 5413
0.066 mm, 0.069 mm Thickness without Liner (Metric) | Amber | Silicone Adhesive
3M™ Polyimide Film Tape 5413 is a high-temperature tape consisting of polyimide film with a silicone adhesive. It is designed for PCB solder masking and other high-temperature applications where dimensional stability, clean removal and reliable heat resistance are required.
Key Features
- Polyimide film provides excellent dimensional stability at elevated temperatures.
- Silicone adhesive offers reliable high-temperature performance with reduced adhesive transfer.
- Suitable for PCB solder masking and other demanding high-temperature applications.
- Flame retardant, chemical resistant and radiation resistant for reliable surface protection.
- Provides a clean release surface and helps reduce adhesive residue after removal.
- Halogen-free tape designed for demanding electronic and industrial applications.
Product Highlights
High Temperature Performance
Designed to perform reliably in demanding high-temperature applications and processes.
Excellent Dimensional Stability
Polyimide film maintains dimensional stability at elevated temperatures, helping minimize rework.
Polyimide Film Backing
High-performance polyimide film provides a durable and reliable tape construction.
Silicone Adhesive
Silicone adhesive provides high-temperature performance while helping reduce adhesive transfer.
Chemical & Radiation Resistant
Helps protect surfaces against harsh chemical and radiation exposure in demanding applications.
Clean Removal
Reduced adhesive transfer helps minimize residue and simplify cleanup after tape removal.
Specifications
| Product Name | 3M™ Polyimide Film Tape 5413 |
|---|---|
| Product Series | 5413 Series |
| Part Number | 5413 |
| Backing Material | Polyimide Film |
| Adhesive Type | Silicone |
| Tape Color | Amber |
| Total Tape Thickness | 0.069 mm / 2.7 mil |
| Backing Thickness | 0.03 mm / 1.0 mil |
| Standard Roll Length | 33 m / 36 yd |
| Temperature Range | -73°C to 260°C (-100°F to 500°F) |
| Adhesion to Steel | 24 N/100 mm |
| Tensile Strength at Break | 578 N/100 mm |
| Elongation at Break | 62% |
| Primary Use | PCB Solder Masking and High-Temperature Applications |
Resources
Technical Data Sheet
View or download the technical data sheet for 3M™ Polyimide Film Tape 5413.
View TDSApplications
PCB Solder Masking
Suitable for protecting selected areas of printed circuit boards during soldering processes.
Wave Soldering
Designed to withstand elevated temperatures encountered during wave soldering applications.
Gold Finger Protection
Can be used to protect gold fingers on printed circuit boards during soldering operations.
High-Temperature Masking
Suitable for masking applications where materials must withstand elevated processing temperatures.
Release Surface
Provides an excellent release surface for parts and components cured at elevated temperatures.
Electrical Applications
Suitable for demanding high-temperature electrical and electronic applications requiring reliable insulation and protection.
Need More Information About This Product?
Contact us for product availability, pricing, technical information and bulk requirements.