3M™ Thermal Bonding Film 583

High-Strength Flexible Thermal Bonding Film

3M™ Thermal Bonding Film 583 is a high-strength, flexible nitrile phenolic based bonding film designed for heat or solvent activated bonding. The film provides strong, permanent bonding and can also be lightly crosslinked through post-heat exposure to improve heat and solvent resistance and increase shear strength.

Key Features

High-strength and flexible nitrile phenolic based bonding film.
Can be activated using heat or solvent depending on the bonding process.
Slight surface tack helps with positioning and handling before bonding.
Can be lightly crosslinked using post-heat exposure.
Crosslinking can improve heat and solvent resistance and increase shear strength.
Can be die-cut for customized shapes and precision bonding applications.

Product Highlights

Heat Activated

Can be heat activated to create a strong, permanent bond for a wide range of industrial assembly applications.

Solvent Activated

The uncured film can also be solvent activated, providing flexibility in different bonding processes.

Flexible Construction

Flexible film construction helps conform to different surfaces and substrates during assembly.

Strong Permanent Bond

Provides a strong and permanent bond after activation for reliable long-term assembly performance.

Die-Cuttable

Can be die-cut into customized shapes for precise bonding and assembly requirements.

Heat Crosslinkable

Post-heat crosslinking can provide additional heat and solvent resistance along with higher shear strength.

Product Construction

3M™ Thermal Bonding Film 583 is based on a nitrile phenolic adhesive film construction. The film has slight surface tack and is designed to be activated by heat or solvent to produce a strong permanent bond.

The film can also be lightly crosslinked using post-heat exposure. Crosslinking provides additional heat and solvent resistance while also increasing shear strength. The product can be die-cut into custom shapes for precision assembly applications.

Specifications

Product Name	3M™ Thermal Bonding Film 583
Manufacturer	3M
Product Series	583
Product Type	Thermal Bonding Film
Base Resin	Nitrile Phenolic
Adhesive Type	Thermoplastic / Thermosetting Bonding Film
Color	Brown
Adhesive Thickness	2 mil (0.05 mm)
Tack	Slight Surface Tack
Activation Method	Heat or Solvent Activation
Crosslinking	Heat Crosslinkable
Die Cutting	Can Be Die-Cut
Maximum Operating Temperature	150°C / 300°F
Tensile Strength Before Crosslinking	400 psi
Tensile Strength After Crosslinking	3,140 psi
Elongation Before Crosslinking	800%
Elongation After Crosslinking	180%
Modulus Before Crosslinking	240 psi
Modulus After Crosslinking	13,800 psi
RoHS Status	RoHS Compliant
Part Status	Active

Resources

Technical Data Sheet

View or download the technical data sheet for 3M Thermal Bonding Film 583.

View TDS

Applications

PCB Manufacturing

Suitable for bonding and splicing applications involving glass fabric during PCB board manufacturing.

Glass Fabric Splicing

Designed for splicing glass fabric where flexible, strong and reliable bonding is required.

Flexible Substrate Bonding

Flexible film construction allows bonding of thin and flexible substrates using suitable heat and pressure.

Industrial Assembly

Suitable for permanent bonding in industrial assemblies requiring high-strength adhesive performance.

Die-Cut Components

Can be die-cut into custom shapes for precise adhesive placement and specialized assembly requirements.

Composite Material Bonding

Useful for bonding composite and industrial materials where strong permanent adhesion is required.

Product Uses

3M™ Thermal Bonding Film 583 is designed for high-strength bonding applications where a flexible film adhesive is required. It can be activated using heat or solvent and can create a strong, permanent bond after activation.

The film is particularly useful for splicing glass fabric during PCB board manufacturing. It can also be used with suitable heated roll laminators, heated static presses, autoclaves and thermode-type bonding equipment depending on the substrate and application.

For applications requiring improved thermal and solvent resistance, the adhesive can be lightly crosslinked using post-heat exposure. This can also provide higher shear strength after crosslinking.