3M™ Thermal Bonding Film 588
High-Strength Flexible Thermosetting Adhesive Film
3M™ Thermal Bonding Film 588 is a high-strength, flexible nitrile phenolic based thermosetting adhesive film designed for demanding bonding applications. The film can be activated using heat or solvent and can also be lightly crosslinked through post-heat exposure.
Key Features
- High-strength, flexible nitrile phenolic based thermosetting adhesive film.
- Can be activated using heat or solvent for convenient bonding and processing.
- Heat crosslinkable option provides improved performance after post-heat exposure.
- Can be die-cut for custom shapes and application-specific component designs.
- 6 mil / 0.15 mm adhesive thickness provides a controlled adhesive film construction.
- Flexible film construction provides excellent workability for electronic and industrial bonding.
- High tensile strength and controlled elongation provide reliable mechanical performance.
- Suitable for glass fabric splicing during PCB board manufacturing applications.
Product Highlights
6 mil / 0.15 mm Adhesive Film
The 0.15 mm adhesive film construction provides a controlled bonding layer for electronic and industrial assembly applications.
Flexible Construction
The flexible film construction allows the adhesive to conform to suitable surfaces and supports complex bonding applications.
Heat Activated
The adhesive film can be heat activated to develop the required bond during assembly and manufacturing processes.
Solvent Activated
The uncured film can also be solvent activated, providing flexibility in manufacturing and bonding processes.
Heat Crosslinkable
Post-heat exposure can lightly crosslink the film, increasing mechanical performance and heat resistance after curing.
Die-Cuttable
The adhesive film can be die-cut into customized shapes for application-specific bonding and assembly requirements.
Specifications
| Product Name | 3M™ Thermal Bonding Film 588 |
|---|---|
| Product Series | 3M™ Thermal Bonding Film |
| Manufacturer | 3M |
| 3M ID | B10167365 |
| Manufacturer Part Number | 3M™ Thermal Bonding Film 588 |
| Series | 588 |
| Product Type | Thermosetting Adhesive Film |
| Base Resin | Nitrile Phenolic |
| Adhesive Thickness | 6 mil / 0.15 mm |
| Liner Thickness | 5 mil Polyolefin Liner |
| Construction | 6 mil Adhesive / 5 mil Polyolefin Liner |
| Color | Yellow |
| Tack | None |
| Activation | Heat or Solvent Activation |
| Heat Crosslinkable | Yes |
| Die-Cuttable | Yes |
| Tensile Strength – Before Crosslinking | 2,300 psi |
| Tensile Strength – After Crosslinking | 2,700 psi |
| Elongation – Before Crosslinking | 250% |
| Elongation – After Crosslinking | 35% |
| Modulus – Before Crosslinking | 6,700 psi |
| Modulus – After Crosslinking | 21,800 psi |
| 2 lb. Dead Load Overlap Shear Heat Resistance – Before Crosslinking | 85°C / 180°F |
| 2 lb. Dead Load Overlap Shear Heat Resistance – After Crosslinking | >149°C / >300°F |
| Storage Temperature | At or Below 4°C / 40°F for Maximum Storage Life |
| Part Status | Active |
| RoHS Status | RoHS Compliant |
Technical values are typical/representative and should not be used as specification limits. Always refer to the latest 3M technical documentation for application- specific requirements, processing conditions and performance specifications.
Resources
Technical Data Sheet
View or download the technical data sheet for 3M™ Thermal Bonding Film 588.
View TDSApplications
PCB Manufacturing
Suitable for bonding and splicing applications during printed circuit board manufacturing, including glass fabric splicing.
Glass Fabric Splicing
Designed for splicing glass fabric where a flexible, high-strength thermosetting adhesive film is required.
Electronic Assembly
Suitable for electronic assembly applications requiring a controlled adhesive film and heat-curing capability.
Heat-Cured Bonding
Useful for applications where heat activation and subsequent thermal curing are required to develop the adhesive bond.
Die-Cut Components
The film can be die-cut into customized geometries for specialized bonding and assembly applications.
Industrial Bonding
Suitable for industrial applications requiring a flexible, high-strength thermosetting adhesive film with controlled activation.
Product Uses
3M™ Thermal Bonding Film 588 is designed for high-strength bonding applications where a flexible thermosetting adhesive film is required. The film can be activated using heat or solvent and can be further crosslinked through post-heat exposure.
The product is particularly useful in PCB manufacturing applications, including the splicing of glass fabric. Its flexible construction allows the film to be processed into application-specific shapes and configurations.
For applications requiring improved thermal resistance and mechanical performance, the adhesive can be lightly crosslinked using a post-heat exposure. After crosslinking, the film demonstrates higher tensile strength, modulus and heat resistance.
The combination of flexibility, heat or solvent activation, heat crosslinkability and die-cutting capability makes 3M™ Thermal Bonding Film 588 a versatile adhesive film for electronics and industrial bonding applications.
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