3M™ Thermally Conductive Interface Tape 8708-025
0.25 mm Thermal Interface Tape – 600mm × 40m Roll
3M™ Thermally Conductive Interface Tape 8708-025 is a pressure sensitive thermal interface tape filled with thermally conductive ceramic particles. It is designed to provide reliable thermal transfer while maintaining electrical insulation, low thermal impedance and good adhesion performance.
Key Features
- Thermal conductivity of approximately 0.6 W/m-K for efficient heat transfer.
- Electrically insulating construction helps provide electrical isolation between components and heat-spreading surfaces.
- Low thermal impedance supports efficient thermal transfer from heat-generating components.
- Soft acrylic adhesive provides good and reliable adhesion to aluminum and stainless steel surfaces.
- Thermally conductive ceramic filler provides effective thermal interface performance.
- 0.25 mm thin construction provides a practical thermal interface for electronic assemblies.
- Vibration damping capability helps support mechanical and thermal interface applications.
- Supplied in a large 600mm × 40m roll for industrial converting and production applications.
Product Highlights
0.6 W/m-K Thermal Conductivity
Provides effective thermal conductivity for heat transfer between electronic components, heat sinks and other thermal management surfaces.
Electrical Insulation
The thermally conductive tape is designed to provide thermal transfer while maintaining electrical insulation between mating surfaces.
Low Thermal Impedance
Low thermal impedance supports efficient transfer of heat across the interface and helps improve thermal management performance.
Reliable Adhesion
Designed for good and reliable adhesion to aluminum and stainless steel surfaces used in thermal management assemblies.
0.25 mm Thin Construction
The thin 0.25 mm profile is suitable for applications where controlled interface thickness and compact assembly are important.
Vibration Damping
The pressure sensitive adhesive construction can also provide vibration damping in electronic and heat sink bonding applications.
Specifications
| Product Name | 3M™ Thermally Conductive Interface Tape 8708-025 |
|---|---|
| Product Series | 3M™ Thermally Conductive Interface Tape 8708 Series |
| Manufacturer | 3M |
| Manufacturer Part Number | 8708-025 |
| Product Type | Thermally Conductive Interface Tape |
| Adhesive Type | Soft Acrylic Adhesive |
| Filler Type | Thermally Conductive Ceramic |
| Product Thickness | 0.25 mm / 9.8 mil |
| Thermal Conductivity | 0.6 W/m-K |
| Thermal Conductivity – X-Y Direction | 0.6 W/m-K |
| Thermal Conductivity – Z Direction | 0.6 W/m-K |
| Dielectric Strength | 15 kV/mm |
| 90° Peel Adhesion – Initial |
Liner Side: > 2000 g/25.4 mm Non-Liner Side: > 800 g/25.4 mm |
| 90° Peel Adhesion – Heat Aged |
Liner Side: > 3000 g/25.4 mm Non-Liner Side: > 1000 g/25.4 mm |
| Dynamic Shear Initial Strength | > 20 kg/in² |
| Product Liner | 130 µm Paper Liner with Red 3M Electronics Logo |
| Roll Length | 40 m |
| Roll Width | 600 mm |
| Packaging | 600 mm × 40 m Roll |
| Application Surface | Aluminum and Stainless Steel (SUS) |
| Electrical Property | Electrically Insulating |
| Vibration Damping | Yes |
| Part Status | Active |
| RoHS Status | RoHS Compliant |
| Storage Shelf Life | 12 Months from Date of Manufacture* |
* Shelf life is based on storage in the original packaging materials at approximately 21°C (70°F) and 50% relative humidity. Technical values are typical/representative and should not be used as specification limits.
Resources
Technical Data Sheet
View or download the technical data sheet for 3M™ Thermally Conductive Interface Tape 8708 Series including 8708-025.
View TDSApplications
General Heat Sink Bonding
Suitable for bonding heat sinks and other thermal management components where efficient thermal transfer and reliable adhesion are required.
IC Chip Packaging
Designed to support thermal conduction from IC and electronic components to designated heat-spreading or cooling structures.
Printed Circuit Boards
Suitable for thermal interface applications on printed circuit board assemblies where electrical insulation is required.
LED Module & Board Bonding
Suitable for LED modules and boards where thermal transfer from heat-generating components to heat sinks or cooling surfaces is required.
Flat Panel Display Assembly
Can be used in flat panel display assemblies for thermal management and component-to-heat spreader interface applications.
COF Chip Heat Conduction
Suitable for chip-on-film thermal management applications where controlled heat transfer and electrical insulation are required.
Product Uses
3M™ Thermally Conductive Interface Tape 8708-025 is designed to provide a thermal interface between heat-generating electronic components and heat dissipation structures. Its thermally conductive ceramic-filled construction helps transfer heat through the interface.
The tape is suitable for applications including general heat sink bonding, IC chip packaging, printed circuit boards, LED module and board bonding, flat panel display assemblies and COF chip heat conduction.
With a thickness of 0.25 mm, thermal conductivity of approximately 0.6 W/m-K, electrical insulation, low thermal impedance and reliable adhesion to aluminum and stainless steel, 8708-025 is suited for a wide range of electronics thermal management and assembly applications.
The 600 mm × 40 m roll format is particularly suitable for industrial processing, converting, die-cutting and high-volume production requirements.
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