3M™ Thermally Conductive Interface Tape 8926
Log Roll 600mm × 40m | 0.25mm Thickness
3M™ Thermally Conductive Interface Tape 8926-025 is a pressure sensitive thermal interface tape filled with thermally conductive ceramic particles. The tape uses a soft acrylic adhesive and a thin PET carrier to provide good converting ability, handling, re-workability and conformability to a variety of surfaces.
Key Features
- Good thermal conductivity of greater than 1.5 W/m-K for effective heat transfer.
- Excellent dielectric performance provides electrical insulation across the interface.
- Low thermal impedance supports efficient thermal transfer from heat-generating components.
- Good and reliable adhesion performance to aluminum and stainless steel surfaces.
- Thermally conductive ceramic particles provide effective thermal interface performance.
- Thin PET carrier provides good converting, handling and re-workability.
- Soft acrylic polymer provides good wet-out and conformability to many surfaces.
- Large 600mm × 40m log roll format is suitable for industrial converting and high-volume production requirements.
Product Highlights
>1.5 W/m-K Thermal Conductivity
Provides good thermal conductivity for transferring heat from electronic components to heat dissipation structures.
Excellent Dielectric Performance
Provides excellent dielectric performance while maintaining the thermal interface between electronic components and cooling surfaces.
Low Thermal Impedance
Designed to support efficient heat transfer across the interface and help improve thermal management performance.
Reliable Adhesion
Provides good and reliable adhesion to many substrates, including aluminum and stainless steel.
Thin PET Carrier
The thin PET carrier improves converting, handling and re-workability while maintaining a flexible thermal interface construction.
Vibration Damping
The adhesive construction can provide vibration damping while supporting thermal and mechanical interface applications.
Specifications
| Product Name | 3M™ Thermally Conductive Interface Tape 8926 |
|---|---|
| Product Variant | 8926-025 |
| Product Series | 3M™ Thermally Conductive Interface Tape 8926 Series |
| Manufacturer | 3M |
| Product Type | Thermally Conductive Interface Tape |
| Adhesive Type | Soft Acrylic Adhesive |
| Filler Type | Ceramic Particles |
| Tape Thickness | 0.25 mm |
| Tape Thickness – Imperial | Approximately 9.8 mil |
| Tape Color | Yellowish White |
| Product Carrier | Thin PET Carrier |
| Product Liner | 75 µm PET Film Liner |
| Thermal Conductivity | > 1.5 W/m-K |
| Electrical Property | Excellent Dielectric Performance |
| Thermal Property | Low Thermal Impedance |
| Adhesion Surface | Aluminum and Stainless Steel |
| Vibration Damping | Yes |
| Roll Width | 600 mm |
| Roll Length | 40 m |
| Roll Format | Log Roll |
| Roll Size | 600 mm × 40 m |
| Converting | Good Converting Ability |
| Handling | Good Handling |
| Re-workability | Good Re-workability |
| Conformability | Good Wet-Out and Conformability |
| Application | Electronic Thermal Management and Heat Dissipation |
Technical values are typical/representative and should not be used as specification limits. Product performance may vary depending on application, substrate, processing conditions and environmental factors. Always refer to the latest 3M technical documentation for application- specific requirements.
Applications
General Heat Sink Bonding
Suitable for bonding heat sinks and providing an efficient thermal interface between heat generating components and cooling structures.
IC Chip Packaging
Designed for heat conduction around IC chip packaging and electronic components requiring thermal management.
Printed Circuit Boards
Suitable for thermal interface applications in printed circuit board assemblies and electronic devices.
LED Module & Board Bonding
Suitable for LED modules and boards where heat must be transferred away from heat-generating components.
Display Assembly
Suitable for display assembly applications including LCD and LED devices requiring thermal management.
COF Chip Heat Conduction
Suitable for chip-on-film applications where thermal conduction and electrical insulation are required.
Product Uses
3M™ Thermally Conductive Interface Tape 8926-025 is designed for thermal management and heat dissipation in electronic devices. The tape provides a thermally conductive interface between heat-generating components and heat-spreading or cooling structures.
The 0.25 mm construction provides a thin and conformable interface while the soft acrylic adhesive allows good wet-out and adhesion to many surfaces. The ceramic filler provides the required thermal conductivity for electronic thermal management.
The tape can be used for general heat sink bonding, IC chip packaging heat conduction, printed circuit boards, LED module and board bonding, display assembly including LCD and LED devices, and COF chip heat conduction.
For mechanical applications, clamp, bracket or screw fastening can also be used in parallel with the tape when additional mechanical retention is required.
The 600 mm × 40 m log roll format makes this product particularly suitable for industrial converting, laminating, slitting and high-volume production applications.
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