3M™ Thermally Conductive Silicone Interface Pad 5516
230mm × 320mm Sheet | 1.5mm Thickness
3M™ Thermally Conductive Silicone Interface Pad 5516 is a soft and conformable thermally conductive silicone interface material designed to provide an effective heat transfer path between heat-generating electronic components and heat sinks, heat spreaders or other cooling structures. The 230mm × 320mm × 1.5mm sheet format is suitable for electronic thermal management, component-level thermal interfaces and industrial converting applications.
Key Features
- High thermal conductivity of 3.1 W/m-K for efficient heat transfer.
- Soft and conformable silicone construction provides excellent surface contact.
- Good dielectric properties provide electrical insulation between components.
- UL 94 V-0 flammability performance for suitable electronic applications.
- 1.5mm thickness is suitable for thermal interfaces with moderate gaps.
- 230mm × 320mm sheet format is suitable for electronic thermal management and custom converting.
Product Highlights
3.1 W/m-K Thermal Conductivity
Provides an efficient thermal path for transferring heat from electronic components to heat sinks and heat-spreading structures.
Soft & Conformable
The soft silicone construction conforms to mating surfaces and helps accommodate minor surface irregularities under low pressure.
Electrical Insulation
Good dielectric properties help provide electrical isolation while maintaining thermal contact.
UL 94 V-0
Suitable for electronic applications where UL 94 V-0 flammability performance is required.
1.5mm Sheet Format
The 1.5mm thickness provides a practical thermal interface for components with moderate interface gaps.
Slightly Tacky Surface
The slightly tacky surface can help with pre-assembly and improve contact between the thermal pad and mating surfaces.
Specifications
| Product Name | 3M™ Thermally Conductive Silicone Interface Pad 5516 |
|---|---|
| Product Series | 3M™ Thermally Conductive Interface Pad 5516 |
| Manufacturer | 3M |
| Manufacturer Part Number | 5516 |
| Product Type | Thermally Conductive Silicone Interface Pad |
| Part Status | Active |
| Base Material | Filled Silicone Polymer |
| Filler Type | Ceramic |
| Sheet Width | 230 mm |
| Sheet Length | 320 mm |
| Sheet Size | 230 mm × 320 mm |
| Thickness | 1.5 mm |
| Thickness – Imperial | Approximately 59 mil |
| Thermal Conductivity | 3.1 W/m-K |
| Hardness | Shore 00 approximately 55–65 for 1.5mm version |
| Dielectric Properties | Good |
| Dielectric Strength | Approximately 3.1 kV/mm |
| Volume Resistivity | Approximately 6.9 × 1014 Ω-cm |
| Flammability | UL 94 V-0 |
| Color | Gray |
| Surface | Slightly tacky |
| Conformability | Good / Highly conformable |
| Wettability | Good |
| Electrical Insulation | Yes |
| Product Format | Sheet |
| Typical Application | Electronic Thermal Management and Heat Transfer |
Applications
IC Packaging Heat Transfer
Suitable for thermal transfer between integrated circuit packages and heat sinks, heat spreaders or cooling structures.
Heat Sink Interface
Provides a soft thermal interface between heat-generating electronic components and heat sinks or other cooling devices.
COF Chip Heat Conduction
Suitable for chip-on-film applications requiring thermal transfer and electrical insulation.
LED Board Thermal Interface
Can be used as a thermal interface material between LED boards, heat spreaders and cooling structures.
HD TV IC Chip Cooling
Suitable for thermal management around IC chips and heat-generating components in display and television electronics.
Electronic Gap Filling
Useful for filling thermal gaps between electronic components and heat-spreading or cooling surfaces.
PCB Thermal Management
Can be used between PCB-mounted components and heat sinks or thermal spreaders where electrical insulation is required.
Electronic Devices
Suitable for thermal management inside electronic equipment where components require a conformable thermal interface.
Custom Thermal Pad Converting
The sheet format can be converted into application-specific shapes through die-cutting, sheeting and other processes.
Product Uses
3M™ Thermally Conductive Silicone Interface Pad 5516 is designed to provide a preferential thermal path between heat-generating electronic components and heat sinks, heat spreaders or other cooling structures.
The soft and conformable silicone construction allows the material to conform to mating surfaces under relatively low pressure. This helps improve contact between the component and cooling structure while reducing mechanical stress on board components.
With a thermal conductivity of 3.1 W/m-K, 5516 provides higher thermal conductivity than many general-purpose silicone interface pads. The material also provides good dielectric properties for applications where thermal transfer and electrical insulation are required.
The slightly tacky surface can support pre-assembly and good wettability at the interface. The material is also available in multiple thicknesses, including 1.5mm, with larger sheet sizes and custom thickness options available for suitable applications.
Typical applications include integrated chip packaging, heat sink interfaces, COF chip heat conduction, LED board thermal interfaces, HD TV IC chip cooling and general thermal gap filling in electronic devices.
The 230mm × 320mm × 1.5mm sheet format is suitable for component-level thermal management as well as industrial converting into application-specific thermal interface components.
Need 3M 5516 Thermal Pad 230mm × 320mm × 1.5mm?
Contact us for product availability, bulk requirements, technical information, custom die-cutting, converting and thermal interface requirements.