3M™ Thermally Conductive Silicone Interface Pad 5514
0.20mm / 0.25mm Thickness | Soft & Conformable Silicone Pad
3M™ Thermally Conductive Silicone Interface Pad 5514 is a soft and conformable silicone elastomer pad filled with thermally conductive ceramic particles. It provides a thermal path between heat-generating electronic components and heat sinks or cooling devices while also providing electrical insulation.
Key Features
- Thermal conductivity of 1.6 W/m-K for effective heat transfer.
- Very soft and conformable silicone construction helps accommodate uneven surfaces.
- Good dielectric properties provide electrical insulation for electronic applications.
- UL 94 V-0 performance for applications requiring flame resistance.
- Thin 0.20mm and 0.25mm versions provide a low-profile thermal interface.
- Good converting ability allows complicated shapes and custom thermal pad designs.
Product Highlights
1.6 W/m-K Thermal Conductivity
Provides an effective thermal path between heat-generating components and heat sinks, heat spreaders or cooling structures.
Soft & Conformable
The soft silicone construction conforms to surfaces and helps maximize contact across the thermal interface.
Good Dielectric Properties
Provides electrical insulation while maintaining thermal contact between electronic components and cooling surfaces.
UL 94 V-0
The 5514 pad provides UL 94 V-0 flammability performance for suitable electronic applications.
Thin Profile
Available in 0.20mm and 0.25mm thicknesses for applications where limited interface space is available.
Good Converting Ability
The flexible material can be converted into complicated shapes and application-specific thermal interface components.
Specifications
| Product Name | 3M™ Thermally Conductive Silicone Interface Pad 5514 |
|---|---|
| Product Series | 3M™ Thermally Conductive Interface Silicone Pad 5514 |
| Manufacturer | 3M |
| Manufacturer Part Number | 5514 |
| Product Type | Thermally Conductive Silicone Interface Pad |
| Material Base | Filled Silicone Polymer |
| Filler Type | Thermally Conductive Ceramic Particles |
| Available Thickness | 0.20 mm / 0.25 mm |
| Thickness – Imperial | Approximately 7.9 mil / 9.8 mil |
| Thermal Conductivity | 1.6 W/m-K |
| Thermal Impedance – 0.20mm | Approximately 2.8 °C-cm²/W |
| Thermal Impedance – 0.25mm | Approximately 3.0 °C-cm²/W |
| Hardness | Approximately Shore 00 = 55 ± 10 |
| Volume Resistivity | 8.6 × 1013 Ω-cm |
| Dielectric Strength | Approximately 14.1 kV/mm |
| Dielectric Constant | Approximately 15.7 |
| Density | Approximately 2.4 g/cm³ |
| Flammability | UL 94 V-0 |
| Adhesion Character | Slightly Tacky / Conformable |
| Carrier | PET Carrier |
| Adhesive | No Added Adhesive Layer |
| Surface Character | Tacky Silicone Surface |
| Conformability | Very Good |
| Flexibility | Good Flexibility with Over-Bending |
| Converting | Good Converting Ability for Complicated Shapes |
| Product Format | Sheet / Roll Available |
| Typical Application | Electronic Thermal Management and Heat Transfer |
Resources
Technical Data Sheet
View technical data for 3M™ Thermally Conductive Silicone Interface Pad 5514.
View TDSApplications
PCB & Heat Sink
Suitable for transferring heat between PCB-mounted components and heat sinks or cooling structures.
IC & COF Applications
Suitable for IC packaging and chip-on-film applications requiring thermal transfer and electrical insulation.
Electronic Gap Filling
Suitable for filling thermal gaps between electronic components and heat-spreading or cooling surfaces.
Product Uses
3M™ Thermally Conductive Silicone Interface Pad 5514 is designed to provide a thermal path between heat-generating electronic components and heat sinks, cooling devices or other heat-spreading structures.
The soft and conformable silicone elastomer construction helps maximize surface contact and accommodate irregular or uneven surfaces. Its slightly tacky surface also helps maintain positioning during assembly.
With thermal conductivity of 1.6 W/m-K and good dielectric properties, the 5514 pad is suitable for electronic thermal management applications where both heat transfer and electrical insulation are required.
The 5514 series is available in thin 0.20mm and 0.25mm thicknesses, making it suitable for applications where limited interface space is available.
The material can also be converted into complicated shapes and application-specific thermal interface components using die-cutting, slitting and other converting processes.
Need 3M 5514 Thermal Pad?
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