3M™ Thermally Conductive Silicone Interface Pad 5514
250mm × 20m Roll | 0.20mm / 0.25mm Thickness
3M™ Thermally Conductive Silicone Interface Pad 5514 is a soft and flexible thermally conductive silicone interface material designed to provide an effective thermal path between heat-generating electronic components and heat sinks or cooling structures. The 250mm × 20m roll format is suitable for industrial converting, cutting and high-volume thermal management applications.
Key Features
- Good thermal conductivity of 1.6 W/m-K for effective heat transfer.
- Soft and flexible silicone construction provides good conformability.
- Good dielectric properties provide electrical insulation.
- UL 94 V-0 performance for suitable electronic applications.
- Thin 0.20mm and 0.25mm thickness options for low-profile thermal interfaces.
- Good converting ability for complicated shapes and application-specific parts.
Product Highlights
1.6 W/m-K Thermal Conductivity
Provides a reliable thermal path for transferring heat from electronic components to cooling structures.
Soft & Flexible
The flexible silicone construction helps conform to mating surfaces and accommodate minor surface irregularities.
Good Dielectric Properties
Provides electrical insulation while maintaining thermal contact between components and heat sinks.
UL 94 V-0
Designed for electronic applications where UL 94 V-0 flammability performance is required.
250mm × 20m Roll
Large roll format supports industrial converting, production processing and high-volume thermal applications.
Good Converting Ability
Can be converted into application-specific thermal pads, complicated shapes and custom components.
Specifications
| Product Name | 3M™ Thermally Conductive Silicone Interface Pad 5514 |
|---|---|
| Product Series | 3M™ Thermally Conductive Interface Pad 5514 |
| Manufacturer | 3M |
| Manufacturer Part Number | 5514 |
| Product Type | Thermally Conductive Silicone Interface Pad |
| Part Status | Active |
| Material | Filled Silicone Polymer |
| Filler Type | Ceramic |
| Roll Width | 250 mm |
| Roll Length | 20 m |
| Roll Size | 250 mm × 20 m |
| Available Thickness | 0.20 mm / 0.25 mm |
| Thickness – Imperial | Approximately 7.9 mil / 9.8 mil |
| Thermal Conductivity | 1.6 W/m-K |
| Hardness | Shore 00 = 58 |
| Dielectric Properties | Good |
| Dielectric Strength | Approximately 14 kV/mm |
| Volume Resistivity | Approximately 8.6 × 1014 Ω-cm |
| Flammability | UL 94 V-0 |
| Color | Gray |
| Flexibility | Good flexibility with over-bending |
| Conformability | Good |
| Converting | Good converting for complicated shapes |
| RoHS Status | RoHS Compliant |
| Product Format | Roll |
| Typical Application | Electronic Thermal Management and Heat Transfer |
Technical values are typical/representative and should not be used as specification limits. Product performance may vary depending on application, compression, substrate, processing conditions and environmental factors. Always refer to the latest 3M technical documentation for application-specific requirements.
Resources
Specification Sheet
View the specification sheet for 3M™ Thermally Conductive Silicone Interface Pad 5514, 250mm × 20m.
View PDFApplications
PCB & Heat Sink
Suitable for heat transfer between PCB-mounted electronic components and heat sinks or cooling structures.
IC & COF Heat Dissipation
Suitable for integrated chip packaging and chip-on-film applications requiring thermal transfer and electrical insulation.
Electronic Gap Filling
Suitable for filling thermal gaps between electronic components and heat-spreading or cooling surfaces.
Product Uses
3M™ Thermally Conductive Silicone Interface Pad 5514 is designed to provide a thermal path between heat-generating electronic components and heat sinks, heat spreaders or other cooling structures.
The soft silicone construction helps accommodate minor surface irregularities while maintaining thermal contact. Its thin profile is suitable for applications where available interface space is limited.
With a thermal conductivity of 1.6 W/m-K and good dielectric properties, 5514 provides both thermal transfer and electrical insulation for electronic thermal management applications.
Typical applications include heat transfer between PCBs and heat sinks, integrated chip packaging, chip-on-film heat dissipation and thermal gap filling inside electronic devices.
The 250mm × 20m roll format is suitable for industrial converting and production requirements. The material can be slit, sheeted or die-cut into application-specific thermal interface components.
Need 3M 5514 Thermal Pad 250mm × 20m?
Contact us for product availability, bulk requirements, technical information, custom die-cutting, slitting and thermal interface converting requirements.