5514 Thermally Conductive Silicone Interface Pad (0.25T X 45MM X 20M )
45mm × 20m Roll | 0.25mm Thickness
3M™ Thermally Conductive Silicone Interface Pad 5514 is a very soft and conformable thermally conductive silicone interface material designed to transfer heat from heat-generating electronic components to heat sinks and cooling devices. The material consists of a slightly tacky silicone elastomeric sheet filled with thermally conductive ceramic particles. Its thin 0.25mm profile and flexible roll format make it suitable for electronic thermal management and converting applications.
Key Features
- Good thermal conductivity of 1.6 W/m-K for effective heat transfer.
- Very soft and conformable silicone construction provides good surface contact.
- Good dielectric properties provide electrical insulation between components.
- UL 94 V-0 flammability performance for suitable electronic applications.
- Thin 0.25mm profile is suitable for low-profile thermal interfaces.
- Good flexibility and converting ability for complicated application-specific shapes.
Product Highlights
1.6 W/m-K Thermal Conductivity
Provides an effective thermal path for transferring heat from electronic components to heat sinks and cooling devices.
Very Soft & Conformable
The soft silicone construction helps conform to mating surfaces and accommodate minor surface irregularities.
Good Dielectric Properties
Provides electrical insulation while maintaining thermal contact between components and cooling structures.
UL 94 V-0
Provides UL 94 V-0 flammability performance for suitable electronic applications.
0.25mm Thin Profile
The thin 0.25mm construction is suitable for applications where interface space is limited.
Good Converting Ability
The flexible material can be converted into complicated shapes and application- specific thermal interface components.
Specifications
| Product Name | 3M™ Thermally Conductive Silicone Interface Pad 5514 |
|---|---|
| Product Series | 3M™ Thermally Conductive Interface Pad 5514 |
| Manufacturer | 3M |
| Manufacturer Part Number | 5514 |
| Product Type | Thermally Conductive Silicone Interface Pad |
| Part Status | Active |
| Material | Silicone Elastomer Filled with Thermally Conductive Ceramic Particles |
| Filler Type | Thermally Conductive Ceramic |
| Roll Width | 45 mm |
| Roll Length | 20 m |
| Roll Size | 45 mm × 20 m |
| Thickness | 0.25 mm |
| Thickness – Imperial | Approximately 9.8 mil |
| Thermal Conductivity | 1.6 W/m-K |
| Hardness | Shore 00 = 58 |
| Dielectric Properties | Good |
| Flammability | UL 94 V-0 |
| Temperature Resistance | High Temperature Resistance |
| Surface | Slightly Tacky |
| Color | Gray |
| Flexibility | Good Flexibility with Overbending |
| Conformability | Very Good |
| Converting | Good Converting for Complicated Shapes |
| RoHS Status | RoHS Compliant |
| Product Format | Roll |
| Typical Application | Electronic Thermal Management and Heat Transfer |
Applications
PCB & Heat Sink
Suitable for heat transfer between PCB-mounted electronic components and heat sinks or cooling devices.
IC Packaging
Suitable for integrated chip packaging applications requiring thermal conduction between components and cooling structures.
COF Heat Dissipation
Suitable for chip-on-film applications requiring thermal transfer and electrical insulation.
Electronic Gap Filling
Suitable for filling thermal gaps between electronic components and heat-spreading or cooling surfaces.
Low Compression Stress
The soft thermal pad construction helps reduce compression stress on electronic components while maintaining thermal contact.
Custom Thermal Pad Converting
Good flexibility and converting ability make the material suitable for complicated shapes and application-specific thermal pads.
Product Uses
3M™ Thermally Conductive Silicone Interface Pad 5514 is designed to transfer heat from heat-generating electronic components to heat sinks, cooling devices and other heat-spreading structures.
The material consists of a slightly tacky silicone elastomeric sheet filled with thermally conductive ceramic particles. Its soft and conformable construction helps provide good contact between mating surfaces.
With a thermal conductivity of 1.6 W/m-K and good dielectric properties, 5514 provides both thermal transfer and electrical insulation for electronic thermal management applications.
The thin 0.25mm profile makes the material suitable for low-profile thermal interfaces where available space between components and cooling structures is limited.
Typical applications include heat transfer between PCBs and heat sinks, integrated chip packaging, chip-on-film heat dissipation and thermal gap filling inside electronic devices.
The soft construction can also help reduce compression stress on electronic parts. The flexible roll format supports converting into complicated shapes and application-specific thermal interface components.
Need 3M 5514 Thermal Pad 0.25mm × 45mm × 20m?
Contact us for product availability, bulk requirements, technical information, custom die-cutting, slitting and thermal interface converting requirements.