Tablet Device
Hold strong from the inside out.
With today's endless appetite for information, connectivity and entertainment, users routinely shift their usage among multiple devices and platforms.
Deliver a powerful, seamless experience into the most rugged, convenient, and transportable tablet designs through enhanced design flexibility and manufacturing agility.
Solutions for Every Tablet Application
From display shielding and OLED glass supporting to graphite bonding, FPC bonding, grounding, PCB shielding, camera shielding and component assembly, our solutions support key components used in modern tablet devices.
Display Shielding
Shielding solutions designed to support display assemblies and help manage electromagnetic interference.
OLED Glass Supporting
Supporting solutions for OLED glass assemblies to help maintain reliable tablet display construction.
Graphite Bonding
Bonding solutions for graphite materials used in thermal management and internal tablet assemblies.
Cover Display Bonding
Bonding solutions for cover displays supporting reliable assembly and long-term adhesion.
Battery Bonding
Bonding solutions designed to secure battery components within compact tablet assemblies.
FPC Bonding
Flexible circuit bonding solutions for compact electronic assemblies and reliable internal connections.
FPC Grounding
Grounding solutions for flexible circuits supporting electrical performance and EMI management.
Speaker Bonding
Bonding solutions for speaker assemblies used in tablet devices and compact electronic enclosures.
PCB Grounding
Grounding solutions for PCB assemblies helping support reliable electrical performance.
Antenna Grounding
Grounding solutions for antenna assemblies supporting RF performance and EMI management.
PCB Shielding
Shielding solutions for PCB assemblies designed to help manage electromagnetic interference.
Shielding Can Lid Tape
Tape solutions for shielding can lid applications supporting reliable EMI shielding assemblies.
Camera Shielding
Shielding solutions around camera assemblies to support compact and reliable tablet construction.
IC Chips Absorber
Absorber solutions for IC chip areas supporting EMI and RF noise management in compact electronic assemblies.
Back Cover Bonding
Bonding solutions for tablet back covers supporting reliable mechanical assembly and clean construction.
Logo Bonding
Bonding solutions for decorative logo components used on tablet device housings.
Camera Bonding
Bonding solutions for decorative camera components and camera assembly applications.
Camera Frame Bonding
Precision bonding solutions for camera frame assemblies used in tablet devices.
Camera Lens Bonding
Bonding solutions for camera lens components supporting reliable optical and mechanical assembly.
Package Bonding
Packaging and component bonding applications supporting tablet manufacturing and assembly requirements.
Explore Tablet Device Application Solutions
Discover bonding, shielding, grounding, absorber and assembly solutions designed for modern tablet devices.